Diffusion soldering using a Gallium metallic paste as solder alloy: study of the phase formation systematics
Diffusion soldering using a Gallium metallic paste as solder alloy: study of the phase formation systematics
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使用镓金属膏作为焊料合金的扩散焊接：相形成系统学的研究
DOI：
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发表时间：
2007
期刊：
影响因子：
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通讯作者：
A. Fernández Guillermet
中科院分区：
文献类型：
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作者：
S. Sommadossi;H. Troiani;A. Fernández Guillermet
在这项工作中，初步结果报告的无铅接头的特性，通过使用扩散焊接方法在700 °C的工艺温度下，在20分钟。焊料合金是包含Ga和Al以及Ni粉末的金属膏，并且基板是Cu和Ni。用SEM和EPMA研究了互连区界面处的溶解和扩散反应过程。高熔点的固溶体和金属间化合物（IMC）形成几乎没有缺陷的层，使工作温度比工艺温度高约500 °C。从Ni到Cu界面的相稳定性顺序为：α′-Ni 3Ga，γ-Cu 9 Ga 4，β-Cu 3Ga和Ga-Cu系的（Cu）固溶体。的相对反应前沿位移的层和本研究结果的扩散焊接方法的适用性的影响进行了讨论。
In this work preliminary results are reported on the characterization of Pb-free joints produced by using a diffusion soldering method at a process temperature of 700 °C during 20 min. The solder alloy is a metallic paste involving Ga and Al and Ni powder, and the substrates are Cu and Ni. The dissolution and diffusion-reaction processes, which take place at the interfaces of the interconnection zone, have been investigated by means of SEM and EPMA. A solid solution and intermetallic compounds (IMCs) with high melting point form as layers almost free from defect, allowing service temperatures about 500 °C higher than the process temperature. The phase stability sequence starting from the Ni to the Cu interface is the following: α′-Ni3Ga, γ-Cu9Ga4, β-Cu3Ga and (Cu) solid solution of the Ga–Cu system. The relative reaction front displacement of the layers and the implications of the present findings for the applicability of the diffusion-soldering method are also discussed.