Unprecedented thermal stability of inherently metastable titanium aluminum nitride by point defect engineering
Unprecedented thermal stability of inherently metastable titanium aluminum nitride by point defect engineering
复制标题
DOI:
10.1080/21663831.2016.1233914
复制
发表时间:
2017-01-01
影响因子:
8.3
通讯作者:
Schneider, Jochen M.
中科院分区:
文献类型:
--
作者:
Baben, Moritz to;Hans, Marcus;Schneider, Jochen M.
Extreme cooling rates during physical vapor deposition (PVD) allow growth of metastable phases. However, we propose that reactive PVD processes can be described by a gas-solid paraequilibrium defining chemical composition and thus point defect concentration. Weshow that this notion allows for point defect engineering by controlling deposition conditions. As example we demonstrate that thermal stability of metastable (Ti, Al) Nx, the industrial benchmark coating for wear protection, can be increased from 800 degrees C to unprecedented 1200 degrees C by minimizing the vacancy concentration. The thermodynamic approach formulated here opens a pathway for thermal stability engineering by point defects in reactively deposited thin films.