Advances in superconducting quantum electronic microcircuit fabrication
Advances in superconducting quantum electronic microcircuit fabrication
复制标题
DOI：
10.1109/tmag.1975.1058675
复制
发表时间：
1975-03
影响因子：
2.1
通讯作者：
R. Kirschman;H. Notarys;J. Mercereau
中科院分区：
文献类型：
--
作者：
R. Kirschman;H. Notarys;J. Mercereau
标准微电子制造技术已被用于批量生产超导量子电子器件和电路。总体目标是一种制造技术，产生坚固耐用的电路，能够在相当数量的控制和可重复制造。本文介绍了我们在实现这一目标方面的进展，重点介绍了最近的工作，其中包括电子束光刻和混合微电子技术的使用。已经成功地制造了几个原型微电路。这些微电路是在由超导层和普通金属层组成的薄膜母材中形成的，并使用邻近效应结构作为有源电路元件。
Standard microelectronic fabrication techniques have been utilized to produce batch quantities of superconducting quantum electronic devices and circuits. The overall goal is a fabrication technology yielding circuits that are rugged and stable and capable of being fabricated controllably and reproducibly in sizeable quantities. Our progress toward this goal is presented, with primary emphasis on the most recent work, which includes the use of electron-beam lithography and techniques of hybrid microelectronics. Several prototype microcircuits have been successfully fabricated. These microcircuits are formed in a thin-film parent material consisting of layers of superconducting and normal metals, and use proximity-effect structures as the active circuit elements.