Microassembly techniques for a three-dimensional neural stimulating microelectrode array.
Microassembly techniques for a three-dimensional neural stimulating microelectrode array.
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三维神经刺激微电极阵列的微组装技术。
DOI：
10.1109/iembs.2006.260836
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发表时间：
2006
期刊：
影响因子：
--
通讯作者：
Wise,KD
中科院分区：
文献类型：
--
作者：
Yao,Y;Gulari,MN;Wise,KD
本文介绍了一种用于中枢神经系统神经刺激和记录的平面外三维微电极阵列的微组装技术。一个互锁机制已被引入到微组装组件，以方便的过程中，增加组装设备的鲁棒性和提高整个系统的产量。体内测试已经证明了微组装3D阵列的全部功能
This paper describes microassembly techniques for an out-of-plane three-dimensional microelectrode array for neural stimulating and recording in the central nervous system. An interlocking mechanism has been introduced into the microassembly components to facilitate the process, increase the robustness of the assembled device and improve the yield of the overall system. In-vivo testing has demonstrated full functionality of the microassembled 3D array