Crack Mitigation during Dealloying of Au25Cu75
Crack Mitigation during Dealloying of Au25Cu75
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DOI：
10.1002/adem.201300211
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发表时间：
2014-04-01
影响因子：
3.6
通讯作者：
Weissmueller, Joerg
中科院分区：
文献类型：
--
作者：
Zhong, Yi;Markmann, Juergen;Weissmueller, Joerg
所建议的将纳米多孔金用于功能和结构应用需要均匀且特别无裂纹的整体式主体，理想地具有在10 nm或更低范围内的结构尺寸。在这里，我们研究两种不同的起始合金，Au 25 Ag 75和Au 25 Cu 75的电化学去合金化，作为实现这一目标的途径。重点是导致裂纹形成的过程中，我们讨论的参数的作用（i）晶格参数的变化，（ii）去合金化的潜力和速率，和（iii）热机械处理的母合金。发现Cu基合金在非常小的结构尺寸下提供上级均匀性，只要避免中间温度处理。完全抑制裂纹的形成，实现了通过应用相对于Ag/AgCl的1.1V的去合金化电位，在韧带尺寸为11 nm。
The suggested use of nanoporous gold for functional and structural applications requires uniform and specifically crack-free monolithic bodies, ideally with a structure size in the range of 10nm or below. Here we investigate electrochemical dealloying of two different starting alloys, Au25Ag75 and Au25Cu75, as pathways towards that goal. With an emphasis on the processes that lead to crack formation, we discuss the role of the parameters (i) lattice parameter change, (ii) dealloying potential and rate, and (iii) thermo-mechanical treatment of the master alloys. The Cu-based alloys are found to give superior homogeneity at very small structure sizes, provided that intermediate temperature treatments are avoided. A complete suppression of crack formation was achieved by application of a dealloying potential of 1.1V versus Ag/AgCl, at a ligament size of 11nm.