Study of the microstructure influence on the transport properties of Bi86.5Sb13.5 polycrystalline alloy
Study of the microstructure influence on the transport properties of Bi86.5Sb13.5 polycrystalline alloy
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DOI：
10.1016/s0022-3697(01)00087-7
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发表时间：
2002
影响因子：
4
通讯作者：
X. Devaux;F. Brochin;R. Martin-Lopez;H. Scherrer
中科院分区：
文献类型：
--
作者：
X. Devaux;F. Brochin;R. Martin-Lopez;H. Scherrer
本文主要研究了Bi_（86.5）Sb_（13.5）多晶合金的输运性质。块体材料的制备通过冷压合金的超细粉末和通过退火所得的粒料。特别注意避免污染粉末。从平均晶粒尺寸为0.06μm的粉末开始，获得了平均晶粒尺寸分别为0.1，0.8，2.5和200μm的块状半导体样品。在80- 330 K温度范围内，研究了晶粒尺寸对电阻率、热导率、热电功率、热电优值的影响。的热电性能进行了讨论，并与以前的研究中提出的单晶。
This study is focused on the investigation of the transport properties of Bi86.5Sb13.5polycrystalline alloys. Bulk materials were prepared by cold pressing ultrafine powders of alloy and by annealing the resulting pellets. Special care was taken to avoid contamination of the powders. Starting with powders of average grain size of 0.06μm bulk semi-conducting sample with mean grain size respectively of 0.1, 0.8, 2.5 and 200μm were obtained. The influence of the grain size on both electrical resistivity, thermal conductivity, thermoelectric power, thermoelectric figure of merit is presented within the range 80–330K. The thermoelectric properties are discussed and compared with those of single crystals presented in previous studies.