Heat load on the first wall materials and interaction of emitted neutrals with plasma

Heat load on the first wall materials and interaction of emitted neutrals with plasma
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第一壁材料上的热负荷以及发射的中性粒子与等离子体的相互作用

DOI:
10.1016/s0022-3115(00)00598-5
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发表时间:
2001
影响因子:
3.1
通讯作者:
S. Tanaka
S. Tanaka
中科院分区:
工程技术2区
文献类型:
--
作者:
Kazuki Kobayashi;S. Kado;B. Xiao;S. Tanaka

文献摘要

被引文献

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在线性稳边等离子体模拟器 MAP-II 中通过实验研究了 H2 与钨靶上的电子和等离子体热负载之间的相互作用。在H2和电子相互作用的区域中,热负荷很大程度上取决于注入的H2气体(NH2)的密度、电子密度(ne)和电子温度(Te)。研究发现,热负荷的增加和减少可以通过几种类型的电子碰撞的特征长度来描述,特征长度由相应碰撞的平均自由程归一化。在本工作测量的等离子体参数中(Teof 5-20 eV和neof 1016-1018/m−3),热负荷的增加主要是由H2的电离引起的,热负荷的减少是由于与H2相互作用导致电子能量减少以及电子-电子碰撞导致电子热化引起的。
The relation between the interactions of H2with electron and plasma heat load to a tungsten target was investigated experimentally in the linear steady edge plasma simulator MAP-II. The heat load shows a large dependence on the density of injected H2gas (NH2), electron density (ne) and electron temperature (Te) in the region of interactions between H2and electrons. It was found that increase and decrease of the heat load can be described by characteristic lengths of several types of electron collisions normalized by the mean free paths of the corresponding collisions. In the plasma parameters surveyed in this work (Teof 5–20 eV and neof 1016–1018/m−3), the increase of the heat load was mainly caused by the ionization of H2and the decrease was caused by the reduction of the electron energy through the interaction with H2and by the thermallization of the electrons through electron–electron collision.