Resistive switching characteristics in dielectric/ferroelectric composite devices improved by post-thermal annealing at relatively low temperature
Resistive switching characteristics in dielectric/ferroelectric composite devices improved by post-thermal annealing at relatively low temperature
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DOI:
10.1063/1.4867260
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发表时间:
2014-03
影响因子:
4
通讯作者:
A. Tsurumaki‐Fukuchi;H. Yamada;A. Sawa
中科院分区:
文献类型:
--
作者:
A. Tsurumaki‐Fukuchi;H. Yamada;A. Sawa
We have investigated the effects of post-thermal annealing on the resistive switching characteristics of dielectric/ferroelectric composite devices of SrRuO3/LaFeO3/Bi1−δFeO3/SrRuO3. Annealing of the devices above 85 °C enhanced the hysteresis of the current–voltage characteristics, resulting in an increase in the resistive switching ratio. After post-thermal annealing at 200 °C, devices with a thicker LaFeO3 layer exhibited a larger resistive switching ratio, and the device-to-device variation in the resistive switching ratio decreased as the LaFeO3-layer thickness was increased. The pulsed-voltage-induced resistive switching characteristics, such as the resistive switching ratio and the switching speed, were also improved by post-thermal annealing.