Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal

Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal
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DOI:
10.1016/j.matdes.2013.06.016
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发表时间:
2013-12-01
期刊:
影响因子:
8.4
通讯作者:
Kim, Jongmyung
Kim, Jongmyung
中科院分区:
材料科学1区
文献类型:
--
作者:
Xiao, Yong;Ji, Hongjun;Kim, Jongmyung

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采用Zn-3Al钎料对Cu/Al异种金属进行了超声辅助钎焊。研究了钎焊温度对Cu/Al接头组织和力学性能的影响。结果表明,在超声振动辅助下,Cu/Al无钎剂钎焊接头可获得良好的钎焊连接。在400 ℃钎焊的接头中,钎料层显示出不均匀的显微组织,并且在Cu界面上发现厚的CuZn 5 IMC层。然而,将钎焊温度提高到440 ° C,导致填料金属层的细化和分散的显微组织以及Cu界面IMC层中的薄Al4.2Cu3.2Zn0.7锯齿状结构。进一步将钎焊温度提高到480 ℃导致填充金属的粗化和Al4.2Cu3.2Zn0.7 IMC层显著生长成枝晶结构。纳米压痕测试表明,Al4.2Cu3.2Zn0.7和CuZn 5相的硬度分别为11.4和4.65 GPa。抗拉强度测试表明,所有接头均在Cu/Al界面处发生断裂。在440 ℃钎焊的接头表现出最高的抗拉强度78.93 MPa。(C)2013爱思唯尔有限公司保留所有权利。
Ultrasound-assisted brazing of Cu/Al dissimilar metals was performed using a Zn-3Al filler metal. The effects of brazing temperature on the microstructure and mechanical properties of Cu/Al joints were investigated. Results showed that excellent metallurgic bonding could be obtained in the fluxless brazed Cu/Al joints with the assistance of ultrasonic vibration. In the joint brazed at 400 degrees C, the filler metal layer showed a non-uniform microstructure and a thick CuZn5 IMC layer was found on the Cu interface. Increasing the brazing temperature to 440 degrees C, however, leaded to a refined and dispersed microstructure of the filler metal layer and to a thin Al4.2Cu3.2Zn0.7 serrate structure in the Cu interfacial IMC layer. Further increasing the brazing temperature to 480 degrees C resulted in the coarsening of the filler metal and the significantly growth of the Al4.2Cu3.2Zn0.7 IMC layer into a dendrite structure. Nanoindentation tests showed that the hardness of the Al4.2Cu3.2Zn0.7 and CuZn5 phase was 11.4 and 4.65 GPa, respectively. Tensile strength tests showed that all the Cu/Al joints were failed in the Cu interfacial regions. The joint brazed at 440 degrees C exhibited the highest tensile strength of 78.93 MPa. (C) 2013 Elsevier Ltd. All rights reserved.