A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization

A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization
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DOI:
10.1016/j.microrel.2012.06.121
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发表时间:
2012-09
期刊:
Microelectron. Reliab.
影响因子:
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通讯作者:
F. L. Henaff;S. Azzopardi;J. Delétage;E. Woirgard;S. Bontemps;J. Joguet
F. L. Henaff;S. Azzopardi;J. Delétage;E. Woirgard;S. Bontemps;J. Joguet
中科院分区:
其他
文献类型:
--
作者:
F. L. Henaff;S. Azzopardi;J. Delétage;E. Woirgard;S. Bontemps;J. Joguet

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