1-D model of current distribution and resistance changes for electromigration in layered lines
1-D model of current distribution and resistance changes for electromigration in layered lines
复制标题
分层线中电迁移的电流分布和电阻变化的一维模型
DOI：
10.1109/16.568035
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发表时间：
1997
期刊：
影响因子：
--
通讯作者：
H. Okabayashi
中科院分区：
文献类型：
--
作者：
D. Grosjean;H. Okabayashi
我们提出了一个一维（1-D）的分析模型，结合接触电阻计算电流分布之间的Al线和难熔金属底层的漂移速度测量结构的电迁移。这样计算的电流分布比通常假设的电流全部在Al部分流动更准确，并且它应该给出漂移速度和电流密度之间更准确和可靠的关系。它也应该是有用的，在相关的局部电流密度与空洞。各种实验观察到的空洞化过程中包括在模型中，他们再现和预测不同类型的变化，总线电阻，最显着的步骤结构中观察到的电迁移。
We present a one-dimensional (1-D) analytical model incorporating contact resistance to calculate the current distribution between an Al line and refractory metal underlayer in a drift velocity measurement structure for electromigration. The current profile so calculated is more accurate than the usual assumption that the current all flows in the Al portion, and it should give a more accurate and reliable relation between drift velocity and current density. It should also be useful in correlating local current density with voiding. Various experimentally observed voiding processes are included in the model; they reproduce and predict different types of changes in total line resistance, most notably the step structure observed in electromigration.