Laser direct-write techniques for printing of complex materials

Laser direct-write techniques for printing of complex materials
复制标题

DOI:
10.1557/mrs2007.11
复制
发表时间:
2007-01-01
期刊:
影响因子:
5
通讯作者:
Pique, Alberto
Pique, Alberto
中科院分区:
材料科学3区
文献类型:
--
作者:
Arnold, Craig B.;Serra, Pere;Pique, Alberto

文献摘要

被引文献

相似文献

本文综述了激光直写加成(LDW+)技术在打印复杂材料方面的最新进展。从小型储能和发电设备到组织工程,各种应用都需要能够沉积多组分和多相材料的精确图案,而不会降低孔隙率、均质性或生物活性等所需的性能。使用LDW+在各种低温和柔性衬底上展示了用于成功制造碱性和锂基微电池、微型超级电容器和染料敏化微型太阳能电池的结构复杂的无机材料。特别是,在保持图案完整性的同时沉积厚层的能力允许以这种方式生产的器件表现出比传统薄膜技术所能实现的更高的单位面积能量密度。然后我们将重点放在更复杂的生物和生物活性材料系统上。生物材料的图案,如蛋白质、DNA,甚至活细胞,可以使用LDW+打印,空间和体积分辨率高达皮升或更低,而不会影响这些微妙结构的生存能力。这些结果为组织工程的高选择性传感器阵列或细胞播种提供了条件。最后,我们回顾了最近在整个半导体电路的LDW+方面的工作,展示了这项技术实现的广泛应用。
This article reviews recent developments in laser direct-write addition (LDW+) processes for printing complex materials. Various applications, ranging from small-scale energy storage and generation devices to tissue engineering, require the ability to deposit precise patterns of multicomponent and multiphase materials without degrading desirable properties such as porosity, homogeneity, or biological activity. Structurally complex inorganic materials for the successful fabrication of alkaline and lithium-based microbatteries, micro-ultracapacitors, and dye-sensitized micro solar cells are shown on various low-processing-temperature and flexible substrates using LDW+. In particular, the ability to deposit thick layers while maintaining pattern integrity allows devices produced in this manner to exhibit higher energy densities per unit area than can be achieved by traditional thin-film techniques. We then focus on more complex systems of living and biologically active materials. Patterns of biomaterials such as proteins, DNA, and even living cells can be printed using LDW+ with high spatial and volumetric resolution on the order of a picoliter or less, without compromising the viability of these delicate structures. These results provide for highly selective sensor arrays or cell seeding for tissue engineering. Finally, we review recent work on LDW+ of entire semiconductor circuits, showing the broad range of applications this technique enables.