Semi-analytical solution of three-dimensional thermoviscoelastic behaviors for a fiber metal laminated plate subjected to laser shock processing

Semi-analytical solution of three-dimensional thermoviscoelastic behaviors for a fiber metal laminated plate subjected to laser shock processing
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激光冲击加工纤维金属层合板三维热粘弹性行为的半解析解

DOI:
10.1016/j.apm.2019.10.059
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发表时间:
2020-03
影响因子:
5
通讯作者:
Hao-Jie Jiang
Hao-Jie Jiang
中科院分区:
工程技术2区
文献类型:
--
作者:
Ning-Hua Gao;Jun-Wei Lian;Hao-Jie Jiang

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基于分离变量法(SVM),获得了纤维金属层合矩形板激光冲击强化过程中的三维瞬态温度分布。然后基于汉密尔顿变分原理建立了三维热粘弹性控制方程。与其他文献不同的是,在空间域和时间域分别采用Galerkin方法和Newmark方法求解了所得到的热粘弹性非线性积分-偏微分方程。同时,采用牛顿-柯特斯梯形公式对变换代数方程组进行卷积运算。研究目的是给出激光冲击强化FML结构三维热粘弹性行为的半解析解,并了解温度、边界条件、激光运动速度以及纤维种类和FML层数对FML结构动态特性(如挠度、振动频率和应力分量)的影响。与挠度相比,面内位移对温度参数更为敏感,温度引起的正应力远大于变形引起的正应力。S2-玻璃纤维环氧树脂的杨氏模量E2比玻璃聚合物小61.7%,剪切应力σ xy只与剪切模量Gxyl(t)有关,剪切应力σ xz只与转角θ和挠度有关,而正应力则与面内位移和温度增量有关。
The three-dimensional transient temperature distribution for a fiber metal laminated (FML) rectangular plate during laser shock processing has been obtained previously based on the separate variable method (SVM). Then the three-dimensional thermoviscoelastic governing equations are formulated based on Hamilton variational principle subsequently. The obtained thermoviscoelastic nonlinear integral-partial differential equations are solved by applying the Galerkin method and Newmark method in space and time domain, respectively, which differs with other publications. Meanwhile, Newton-Cotes trapezoidal formula is adopted to conduct the convolution operator for the transforming algebraic equations. The research aims at giving the semi-analytical solution of three-dimensional thermoviscoelastic behaviors for the FML structure subjected to laser shock processing, besides understanding the influences of temperature, boundary condition, laser moving velocity as well as number of fiber species and FML layers on the dynamic characteristic (such as deflection, vibration frequency and stress components) of the FML structure. Comparing with the deflection, the in-plane displacement is more sensitive to the temperature parameter, and normal stress caused by temperature is far greater than that caused by deformation. Young's modulus E 2 for S 2-glass fiber epoxy is less than that of glass polymer about 61.7%; shear stress σ xy is only associated with shear modulus G x y l (t); Shear stress σ xz is only associated with rotation angle ϕ and deflection, while normal stress is associated with in-plane displacement and temperature increment.
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