Effect of surfactants on the behavior of the Ni-P bath and on the formation of electroless Ni-P-TiC composite coatings

Effect of surfactants on the behavior of the Ni-P bath and on the formation of electroless Ni-P-TiC composite coatings
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DOI:
10.1016/j.surfcoat.2019.01.046
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发表时间:
2019-03-15
影响因子:
5.4
通讯作者:
Baumli, P.
Baumli, P.
中科院分区:
材料科学1区
文献类型:
--
作者:
Czagany, M.;Baumli, P.

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本文系统地研究了三种不同类型的表面活性剂(阴离子表面活性剂SDBS、阳离子表面活性剂CTAB和非离子表面活性剂PVP)对含TiC纳米颗粒的Ni-P化学镀液的行为和Ni-P-TiC复合镀层形成的影响。表面活性剂的影响可以在界面现象中观察到,即在涂层形成期间的润湿和电动行为。通过座滴法研究了镀液的润湿性能,结果表明,在阴离子和阳离子表面活性剂的情况下,镀液在所有三种基材(W302钢、TiC、Ni-P镀层基材)上的润湿性均得到改善。Zeta电位的测定表明,Ni-P镀液中TiC颗粒的稳定性较蒸馏水中有所降低,导致TiC颗粒团聚。通过在蒸馏水中的所有三种类型的表面活性剂(lg/L)实现低于100 nm的TiC团聚体尺寸;然而,在Ni-P浴中仅测量到较大的团聚体。最后在钢基体上制备了Ni-P-TiC复合镀层。涂层横截面的研究表明,最高量的TiC(0.53wt.%和0.52wt. %)分别使用0.1g/L CTAB和0.1g/L PVP掺入到Ni-P基体中,尽管这些颗粒形成较大的团聚体。
The present study is a systematic investigation into the effect of three different types of surfactants (anionic: SDBS, cationic: CTAB, and non-ionic: PVP) on the behaviour of electroless Ni-P baths containing TiC nanoparticles, and on the formation of Ni-P-TiC composite coatings. The effect of surfactants can be observed in the interfacial phenomena, i.e. wetting and electrokinetic behaviour during the formation of the coating. The wetting properties of the coating bath were investigated by the sessile drop method, which revealed the wetting improvement on all three substrates (W302 steel, TiC, Ni-P coating substrates) in the case of the anionic and cationic surfactant. The Zeta potential measurement showed a stability decrease in Ni-P bath compared to the distilled water medium, which led to the agglomeration of the TiC particles. TiC agglomerate size below 100 nm was achieved by all three types of surfactant (1 g/L) in distilled water; however, only larger agglomerates were measured in the Ni-P bath. Finally, the Ni-P-TiC composite coatings on steel substrate were created. The investigation of the cross-section of the coatings revealed that, the highest amount of TiC (0.53 wt.% and 0.52 wt. %) was incorporated in the Ni-P matrix with the use of 0.1 g/L CTAB and 0.1 g/L PVP respectively, although these particles formed larger agglomerates.