Using Via Stubs in Periodic Structures for Microwave Filter Design
Using Via Stubs in Periodic Structures for Microwave Filter Design
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DOI：
10.1109/tcpmt.2014.2314074
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发表时间：
2014-04
期刊：
影响因子：
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通讯作者：
A. Hardock;Y. Kwark;R. Rímolo-Donadío;H. Bruns;C. Schuster
中科院分区：
文献类型：
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作者：
A. Hardock;Y. Kwark;R. Rímolo-Donadío;H. Bruns;C. Schuster
本文提出了一种新型微波滤波器结构，使用通用印刷电路板中的通孔（电镀通孔）作为主要构建块。事实证明，对于某种通孔布置，通孔桩的谐振行为可用于分别使用开路或短路通孔创建低通或高通滤波器。这些短截线周期性地级联，类似于使用传输线短截线滤波器的类似实现。将表明，这种通孔滤波器结构可以在GHz频率的通带中实现低于0.1dB的插入损耗和约-60dB的回波损耗。通过测量、全波和基于物理的仿真来验证这种新颖的滤波器概念，并提供 1 至 20 GHz 频率范围内的设计指南。
This paper presents a novel form of microwave filter construction using vias (plated through holes) available in generic printed circuit boards as the main building block. It is demonstrated that for a certain arrangement of vias, the resonant behavior of via stubs can be used to create a low- or a high-pass filter using open- or short-circuited vias, respectively. These stubs are periodically cascaded, resembling an analogous implementation using transmission-line stub filters. It will be shown that such a via filter structure can achieve insertion loss lower than 0.1 dB and return loss of about -60 dB in the passband at GHz frequencies. Measurements, full-wave, and physics-based simulations are presented to verify this novel filter concept and to provide design guidelines in the frequency range from 1 to 20 GHz.