Chip-to-chip quantum teleportation and multi-photon entanglement in silicon
Chip-to-chip quantum teleportation and multi-photon entanglement in silicon
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硅基片上芯片间量子隐形传态及多光子纠缠
DOI:
10.1038/s41567-019-0727-x
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发表时间:
2019-12-23
期刊:
影响因子:
19.6
通讯作者:
Thompson, Mark G.
中科院分区:
文献类型:
--
作者:
Llewellyn, Daniel;Ding, Yunhong;Thompson, Mark G.
Integrated optics provides a versatile platform for quantum information processing and transceiving with photons(1-8). The implementation of quantum protocols requires the capability to generate multiple high-quality single photons and process photons with multiple high-fidelity operators(9-11). However, previous experimental demonstrations were faced by major challenges in realizing sufficiently high-quality multi-photon sources and multi-qubit operators in a single integrated system(4-8), and fully chip-based implementations of multi-qubit quantum tasks remain a significant challenge(1-3). Here, we report the demonstration of chip-to-chip quantum teleportation and genuine multipartite entanglement, the core functionalities in quantum technologies, on silicon-photonic circuitry. Four single photons with high purity and indistinguishablity are produced in an array of microresonator sources, without requiring any spectral filtering. Up to four qubits are processed in a reprogrammable linear-optic quantum circuit that facilitates Bell projection and fusion operation. The generation, processing, transceiving and measurement of multi-photon multi-qubit states are all achieved in micrometre-scale silicon chips, fabricated by the complementary metal-oxide-semiconductor process. Our work lays the groundwork for large-scale integrated photonic quantum technologies for communications and computations.Four single-photon states are generated and entangled on a single micrometre-scale silicon chip, and provide the basis for the demonstration of chip-to-chip quantum teleportation.