Chip-to-chip quantum teleportation and multi-photon entanglement in silicon

Chip-to-chip quantum teleportation and multi-photon entanglement in silicon
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硅基片上芯片间量子隐形传态及多光子纠缠

DOI:
10.1038/s41567-019-0727-x
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发表时间:
2019-12-23
期刊:
影响因子:
19.6
通讯作者:
Thompson, Mark G.
Thompson, Mark G.
中科院分区:
物理与天体物理1区
文献类型:
--
作者:
Llewellyn, Daniel;Ding, Yunhong;Thompson, Mark G.

文献摘要

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集成光学为量子信息处理和光子捕获提供了一个多功能平台(1-8)。量子协议的实现需要能够生成多个高质量的单光子,并使用多个高保真算子处理光子(9-11)。然而,以前的实验演示在实现足够高质量的多光子源和多量子位操作员在一个单一的集成系统(4-8),和多量子位量子任务的完全基于芯片的实现仍然是一个重大的挑战(1-3)。在这里,我们报告了芯片到芯片的量子隐形传态和真正的多体纠缠,量子技术的核心功能,在硅光子电路的演示。在微谐振器光源阵列中产生了四个高纯度、高稳定性的单光子,而不需要任何光谱滤波。多达四个量子位在可重编程的线性光学量子电路中处理,便于贝尔投影和融合操作。多光子多量子比特态的产生、加工、存储和测量都是在微米级的硅芯片上实现的,这些芯片采用互补金属氧化物半导体工艺制造。我们的工作为大规模集成光子量子通信和计算技术奠定了基础,在单个微米尺度的硅芯片上实现了四个单光子态的纠缠,为实现芯片到芯片的量子隐形传态提供了基础。
Integrated optics provides a versatile platform for quantum information processing and transceiving with photons(1-8). The implementation of quantum protocols requires the capability to generate multiple high-quality single photons and process photons with multiple high-fidelity operators(9-11). However, previous experimental demonstrations were faced by major challenges in realizing sufficiently high-quality multi-photon sources and multi-qubit operators in a single integrated system(4-8), and fully chip-based implementations of multi-qubit quantum tasks remain a significant challenge(1-3). Here, we report the demonstration of chip-to-chip quantum teleportation and genuine multipartite entanglement, the core functionalities in quantum technologies, on silicon-photonic circuitry. Four single photons with high purity and indistinguishablity are produced in an array of microresonator sources, without requiring any spectral filtering. Up to four qubits are processed in a reprogrammable linear-optic quantum circuit that facilitates Bell projection and fusion operation. The generation, processing, transceiving and measurement of multi-photon multi-qubit states are all achieved in micrometre-scale silicon chips, fabricated by the complementary metal-oxide-semiconductor process. Our work lays the groundwork for large-scale integrated photonic quantum technologies for communications and computations.Four single-photon states are generated and entangled on a single micrometre-scale silicon chip, and provide the basis for the demonstration of chip-to-chip quantum teleportation.