An even wiring approach to the ball grid array package routing
An even wiring approach to the ball grid array package routing
复制标题
球栅阵列封装布线的均匀布线方法
DOI：
10.1109/iccd.1999.808555
复制
发表时间：
1999
期刊：
影响因子：
--
通讯作者：
Chia
中科院分区：
文献类型：
--
作者：
Shuenn;Jong;Sao;Chia
提出了BGA包的均匀路由器，以将每个芯片的I/O垫互连到分布在基板区域上的相应球。路由器的主要阶段包括层分配，拓扑路由和物理路由。使用此路由器，我们可以生成平面和任何角线的均匀分布，以提高制造产量。我们还进行了各种测试示例，以验证该路由器的效率。实验表明，路由器产生的效果非常好，远比手动设计要好得多，因此实际上可以应用于VLSI包装。
An even-wiring router for the BGA package is presented to interconnect each I/O pad of a chip to a corresponding ball distributed on the substrate area. The major phases for the router consist of layer assignment, topological routing, and physical routing. Using this router, we can generate an even distribution of planar and any-angle wires to improve manufacturing yield. We have also conducted various testing examples to verify the efficiency of this router. Experiments show that the router produces very good results, far better than the manual design, thus it can be practically applied to VLSI packaging.