Kinetic control of a particle by voltage sequence for a nonimpact electrostatic micromanipulation
Kinetic control of a particle by voltage sequence for a nonimpact electrostatic micromanipulation
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DOI：
10.1063/1.1609039
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发表时间：
2003-09
期刊：
影响因子：
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通讯作者：
S. Saito;Hideo Himeno;Kunio Takahashi;M. Urago
中科院分区：
文献类型：
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作者：
S. Saito;Hideo Himeno;Kunio Takahashi;M. Urago
这封信描述了一种电压序列的计算，以获得粒子的非碰撞静电微操纵的运动控制。该系统由导电物体组成：操作探头、球形颗粒和基板。粒子最初附着在探头尖端，通过施加的电压分离。用数值边界元方法计算了颗粒运动到衬底时所受的静电力。我们通过考虑粒子的总做功来确定粒子在基片上非碰撞沉积的电压和时间序列。计算提供了非冲击式粒子沉积的电源要求。
This letter describes a calculation of a voltage sequence to obtain kinetic control of a particle for nonimpact electrostatic micromanipulation. The system consists of conductive objects: A manipulation probe, a spherical particle, and a substrate plate. The particle, initially adhering to the probe tip, is detached by an applied voltage. The electrostatic force acting on the particle during its movement to the substrate is calculated by a numerical boundary element method. We determine the voltage and time sequence for nonimpact deposition of the particle onto the substrate by considering the total work to the particle. The calculation provides the power source requirements for nonimpact particle deposition.