Fabrication of YBCO Film Using a New Copper Precursor by Chemical Solution Method
Fabrication of YBCO Film Using a New Copper Precursor by Chemical Solution Method
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DOI：
10.1007/s10948-012-1503-7
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发表时间：
2012-03
影响因子：
1.8
通讯作者：
L. Jin;Y. F. Lu;J. Feng;Z. Yu;Y. Wang;C. Li
中科院分区：
文献类型：
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作者：
L. Jin;Y. F. Lu;J. Feng;Z. Yu;Y. Wang;C. Li
采用三氟乙酸钇、三氟乙酸钡和无氟铜前驱体混合的前驱体溶液制备了YBCO薄膜。在快速热解过程中获得了无裂纹的膜。用x射线衍射、扫描电镜和电感法分别对薄膜的织构、微结构和超导性能进行了表征。研究了升温速率对YBCO薄膜的相形成、织构和临界性能的影响。织构和临界电流密度随升温速率变化显著。在3 K/min的升温速率下制备的YBCO薄膜的Jc为1.7MA/cm 2。
YBCO films were fabricated by using a modified precursor solution, which was prepared by mixing yttrium trifluoroacetate, barium trifluoroacetate, and a fluorine-free copper precursor. Crack-free films have been obtained in a rapid pyrolysis process. The texture, microstructure and superconducting properties of films were characterized by x-ray diffraction, scanning electron microscopy, and the inductive method, respectively. The effect of the heating rate on the phase formation, texture and critical properties (Jc) of YBCO films was investigated. The texture and critical current density varied significantly with the heating rate. Moreover, theJcof 1.7 MA/cm2was obtained for YBCO films prepared at the heating rate of 3 K/min.