Electrical Interconnect Test Method of 3D ICs by Injected Charge Volume

Electrical Interconnect Test Method of 3D ICs by Injected Charge Volume
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通过注入电荷量进行 3D IC 的电气互连测试方法

DOI：
10.1109/3dic.2015.7334588
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发表时间：
2015
期刊：
Proc. of　IEEE 3D System Integration Conference 2015
影响因子：
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通讯作者：
Hiroyuki Yotsuyanagi and Shyue-Kung Lu
Hiroyuki Yotsuyanagi and Shyue-Kung Lu
中科院分区：
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文献类型：
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作者：
Daisuke Suga;Masaki Hashizume;Hiroyuki Yotsuyanagi and Shyue-Kung Lu

文献摘要

相似文献

In this paper, an electrical test method and a power supply circuit are proposed for open defects at interconnects between dies in a 3D IC. The test method is based on volume of charge injected from the power supply circuit. Feasibility of the electrical tests is examined by Spice simulation. The simulation results show that a hard open defect, capacitive ones and resistive ones whose resistance is greater than or equal to 100Ω may be detected at a test speed of 0.9MHz.