A high accuracy resonant pressure sensor by fusion bonding and trench etching
A high accuracy resonant pressure sensor by fusion bonding and trench etching
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DOI：
10.1016/s0924-4247(99)00065-5
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发表时间：
1999-08-30
影响因子：
4.6
通讯作者：
Bertioli, MM
中科院分区：
文献类型：
--
作者：
Welham, CJ;Greenwood, J;Bertioli, MM
提出了一种基于静电驱动和压电传感的“双梭”横向谐振器的压力传感器。谐振器已被设计使用简单的梁理论和模式的形状研究，使用有限元分析。该传感器采用熔融键合、晶片减薄和沟槽蚀刻工艺制造。初步装置的测量产生的基本频率约为50 kHz和Q-因子1000在空气中在大气压下，上升到超过50，000在高真空（< 0.01毫巴）。在10巴的压力范围内，120 μ m厚的膜片的相对压力灵敏度为3.8%巴（-1），在3巴的压力范围内，25 μ m厚的膜片的相对压力灵敏度为15%巴（-1）。(C)1999年Elsevier Science S.A. All rights reserved.
A pressure sensor based upon an electrostatically driven and piezoresistively sensed 'double-shuttle' lateral resonator is presented. The resonator has been designed using simple beam theory and the mode shapes investigated using finite element analysis. The sensor is fabricated using fusion bonding, wafer thinning and trench etching. Measurements of preliminary devices yield a fundamental frequency of approximate to 50 kHz and Q-factor of 1000 in air at atmospheric pressure, rising to over 50,000 in high vacuum (< 0.01 mbar). The relative pressure sensitivity of the sensor is measured to be 3.8% bar(-1) for a 120 mu m thick diaphragm over a pressure range of 10 bar, and 15% bar(-1) for a 25 mu m thick diaphragm over a pressure range of 3 bar. (C) 1999 Elsevier Science S.A. All rights reserved.