Microstructure and properties of Al/Cu bimetal in liquid-solid compound casting process
Microstructure and properties of Al/Cu bimetal in liquid-solid compound casting process
复制标题
DOI：
10.1016/s1003-6326(16)64261-9
复制
发表时间：
2016-06-01
影响因子：
4.5
通讯作者：
Zhu, Zi-ang
中科院分区：
文献类型：
--
作者：
Hu, Yuan;Chen, Yi-qing;Zhu, Zi-ang
采用化学镀方法在铜基体上沉积Ni-P镀层，采用固液复合铸造技术制备Al/Cu双金属。研究了不同工艺参数（焊接温度和预热时间）的Al/Cu接头的显微组织、力学性能和导电率。结果表明，界面处形成了金属间化合物，并且随着键合温度和预热时间的增加，金属间化合物的厚度和种类增加。 Ni-P中间层起到扩散阻挡层和保护膜的作用，有效减少了金属间化合物的形成。通过增加金属间化合物的厚度，降低了Al/Cu双金属的剪切强度和电导率。尤其是Al2Cu相的有害作用较其他相更为明显。在780℃预热150s的样品表现出最大剪切强度和电导率分别为49.8MPa和5.29x10(5)S/cm。
A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid-liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters (bonding temperature and preheating time) were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni-P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 degrees C for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29x10(5) S/cm, respectively.