An X-ray TES Detector Head Assembly for a STEM?EDS System and Its Performance
An X-ray TES Detector Head Assembly for a STEM?EDS System and Its Performance
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用于 STEM?EDS 系统的 X 射线 TES 探测器头组件及其性能
DOI：
10.1007/s10909-018-2013-1
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发表时间：
2018
影响因子：
2
通讯作者：
Hara Toru
中科院分区：
文献类型：
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作者：
Hayashi Tasuku;Muramatsu Haruka;Maehisa Keisei;Yamasaki Noriko Y.;Mitsuda Kazuhisa;Takano Akira;Yoshimoto Shota;Maehata Keisuke;Hidaka Mutsuo;Yamamori Hirotake;Hara Toru
设计、制造并测试了一种用于扫描透射电子显微镜（STEM）的能量色散X射线光谱仪（EDS）的探测头。一个64像素的TES X射线微量热计和64 SQUID阵列放大器（SAA）安装在一个探测器头，这是冷却到约100 mK。探测头主体为一根铜杆，横截面约1cm，长10 cm，底部为3 cm立方体结构。TES微量热计安装在杆的顶部，而SAA安装在立方体结构的四个侧表面上。为了减少引线键合的数量，我们采用了倒装芯片键合的SAA。为了减少由于SAA芯片和安装表面的线性热膨胀差异而施加在倒装芯片接合上的应力，我们将SAA和连接器安装到蓝宝石电路板上的室温电子器件上，并使用超导倒装芯片接合技术安装SAA和连接器。然后，TES和蓝宝石电路板都安装在杆上，并连接到印刷电路，就像超导导线一样，用Al线键合在杆的多个表面上形成。我们将引线键合的数量从768个减少到256个。倒装芯片键合的成品率并不完美，但相对较高。我们将探测器头安装在STEM EDS系统中，确认满足能量分辨率和计数要求，5 kcps。
A detector head for an energy-dispersive X-ray spectroscopy (EDS) for a scanning transmission electron microscope (STEM) was designed, fabricated, and tested. A 64-pixel TES X-ray microcalorimeter and 64 SQUID array amplifiers (SAAs) are mounted on a detector head which is cooled to about 100 mK. The body of the detector head is a copper rod of aboutcross section and 10 cm length with 3 cm cubic structure at the bottom. The TES microcalorimeter is mounted at the top of the rod while the SAAs are mounted on the four side surfaces of the cubic structure. In order to reduce the number of wire bondings, we adopted a flip-chip bonding for the SAAs. In order to reduce the stress imposed on the flip-chip bondings due to the difference in the linear thermal expansion of the SAA chip and the mounting surfaces, we mounted the SAAs and connectors to the room-temperature electronics on sapphire circuit board and mounted the SAAs and connectors using a superconducting flip-chip bonding technology. Then, both the TES and the sapphire circuit board were mounted on the rod and are connected to the print circuit like superconducting wires, which are created on the multiple surfaces of the rod, with Al wire bondings. We reduced the number of wire bondings from 768 to 256. The yield of the flip-chip bonding was not perfect but relatively high. We installed the detector head in the STEM EDS system, confirmed that the energy resolution and counting requirements,with 5 kcps were fulfilled.