High-Speed Receiver Technology on the SOI Platform
High-Speed Receiver Technology on the SOI Platform
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DOI：
10.1109/jstqe.2012.2213804
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发表时间：
2013-03-01
影响因子：
4.9
通讯作者：
Asghari, Mehdi
中科院分区：
文献类型：
--
作者：
Feng, Dazeng;Qian, Wei;Asghari, Mehdi
数据中心需要低功耗、低成本和高速光子链路。经过过去几年的大量研究和开发工作，硅光子学已成为提供该技术的有希望的候选者。接收器是光子链路的关键组件之一。在本文中，我们报告了绝缘体上硅平台接收器技术的最新进展，特别是其在利用波分复用 (WDM) 的链路中的应用。首先，我们讨论 WDM 接收器的关键构建模块：中阶梯光栅解复用器和高速 Ge 光电探测器。然后，我们报告了通过 40 个高速 Ge 光电二极管与 40 通道密集波分复用阶梯光栅的单片集成来演示太比特/秒 WDM 接收器芯片。该器件表明硅光子学是实现低功耗和低成本数据中心应用的关键技术。
Low power, low-cost, and high-speed photonic links are required in data centers. After significant research and development work over the last few years, silicon photonics has become a promising candidate to provide this technology. The receiver is one of the critical components for a photonic link. In this paper, we report recent progress in receiver technology on the silicon-on-insulator platform, particularly regarding its application to links that utilize wavelength division multiplexing (WDM). First, we discuss the key building blocks for WDM receivers: echelle grating demultiplexers and high-speed Ge photodetectors. We then report on the demonstration of a Terabit/s WDM receiver chip through monolithic integration of 40 high-speed Ge photodiodes with a 40-channel dense wavelength division multiplexing echelle grating. The device demonstrates that silicon photonics is a key technology to enable low-power and low-cost data center applications.