Development of stress-optimised shape memory microvalves

Development of stress-optimised shape memory microvalves
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DOI:
10.1016/s0924-4247(98)00221-0
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发表时间:
1999-02-16
影响因子:
4.6
通讯作者:
Miyazaki, S
Miyazaki, S
中科院分区:
工程技术3区
文献类型:
--
作者:
Kohl, M;Skrobanek, KD;Miyazaki, S

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一种由100 μ m厚度的应力优化梁组成的形状记忆微器件已经开发出来,用于驱动高压应用的膜微阀。微梁的横向宽度设计为沿梁表面均匀的应力分布,允许优化使用形状记忆效应和最小化疲劳效应。红外显微镜对光束的研究显示,最大温度变化为14k。对于阀门的驱动,采用了菱形相变。这允许在压力差低于1200 hPa的设计中使用一个阀室,在膜上方的第二个阀室的压力补偿设计中使用低于4500 hPa的压力差。在210兆瓦的驱动功率下,最大气体流量为1600似乎,工作输出为35亩N米。关闭阀门的响应时间在0.5到1.2 a之间变化,打开阀门的响应时间在1到2 s之间变化,这取决于施加的压力差。(C) 1999 Elsevier Science S.A.版权所有
A shape memory microdevice consisting of stress-optimised beams of 100 mu m thickness has been developed to actuate a membrane microvalve for high pressure applications. The lateral widths of the microbeams are designed for homogeneous stress distributions along the beam surfaces allowing an optimised use of the shape memory effect and a minimisation of fatigue effects. Infrared microscopy investigations of the beams reveal maximum temperature variations of 14 K. For valve actuation, a rhombohedral phase transformation is used. This allows operation below pressure differences of 1200 hPa in designs with one valve chamber and below 4500 hPa in pressure-compensated designs with a second valve chamber above the membrane. Maximum gas flows of 1600 seem and work outputs of 35 mu N m are achieved for a driving power of 210 mW. The response times for closing the valves vary between 0.5 and 1.2 a and for opening between 1 and 2 s depending on the applied pressure difference. (C) 1999 Elsevier Science S.A. All rights reserved.