Generic principles of crack-healing ceramics
Generic principles of crack-healing ceramics
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DOI：
10.1007/s40145-012-0020-2
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发表时间：
2012-10
影响因子：
16.9
通讯作者：
P. Greil
中科院分区：
文献类型：
--
作者：
P. Greil
陶瓷材料能够修复制造或损伤引起的微结构缺陷，可能会引发承载陶瓷设计和应用范式的变化。这项工作回顾了热力学和动力学方面的固体接触再生能够在陶瓷破碎裂纹表面之间转移应力。主要的裂纹愈合过程包括裂纹样孔的扰动，随后是孤立孔的烧结，以及与环境气氛的反应和用氧化产物填充裂纹空间。由于热激活固态反应需要可能超过1000 °C的高温，因此能够在较低温度下引发裂纹愈合的工艺对于转移到工程应用中特别感兴趣。微观结构的修改，能够促进裂纹修复在较低的温度下的一般原则将被认为是：（一）加速材料运输的晶界装饰和晶粒尺寸减小，及（二）减少热激活障碍修复填料活化。证明裂纹愈合能力的实例包括来自纳米层压MAX相的低能键合插层金属的氧化反应和含有修复填料的聚合物衍生的陶瓷的催化表面氮化。
Ceramic materials able to heal manufacture or damage induced microstructure defects might trigger a change in paradigm for design and application of load bearing ceramics. This work reviews thermodynamic and kinetic aspects governing the regeneration of solid contact able to transfer stress between disrupted crack surfaces in ceramics. Major crack healing processes include perturbation of crack-like pores followed by sintering of isolated pores, as well as reaction with an environmental atmosphere and filling of the crack space with an oxidation product. Since thermally activated solid state reactions require elevated temperatures which may exceed 1000 °C, processes able to trigger crack healing at lower temperatures are of particular interest for transferring into engineering applications. Generic principles of microstructure modifications able to facilitate crack repair at lower temperatures will be considered: (i) acceleration of material transport by grain boundary decoration and grain size reduction, and (ii) reduction of thermal activation barrier by repair filler activation. Examples demonstrating crack healing capability include oxidation reaction of low energy bonded intercalation metal from nano-laminate MAX phases and catalyzed surface nitridation of polymer derived ceramics containing repair fillers.