Grain Boundary Migration in Polycrystals

Grain Boundary Migration in Polycrystals
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多晶体中的晶界迁移

DOI:
10.1146/annurev-matsci-080921-091511
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发表时间:
2023-02
影响因子:
9.7
通讯作者:
G. Rohrer;I. Chesser;A. Krause;S. K. Naghibzadeh;Zipeng Xu;K. Dayal;E. Holm
G. Rohrer;I. Chesser;A. Krause;S. K. Naghibzadeh;Zipeng Xu;K. Dayal;E. Holm
中科院分区:
材料科学2区
文献类型:
--
作者:
G. Rohrer;I. Chesser;A. Krause;S. K. Naghibzadeh;Zipeng Xu;K. Dayal;E. Holm

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多晶材料中的晶界迁移以减少总的过剩能量。最近发现,控制双晶晶界迁移速率的因素不足以解释多晶晶界迁移。我们首先基于模拟和高分辨率透射电子显微镜观察回顾了我们目前对晶界迁移原子机制的理解。然后,我们基于使用高能衍射显微镜的模拟和观察来回​​顾我们目前在连续尺度上的理解。我们得出的结论是,需要将实验观察与多晶(而不是双晶)中迁移的原子模拟进行详细比较,以更好地理解晶界迁移的机制,多晶中晶界迁移的驱动力必须包括曲率以外的因素,并且当前的晶粒生长模拟不足以再现实验观察结果,可能是因为驱动力的表示不充分。 《材料研究年度评论》第 53 卷的预计最终在线发布日期为 2023 年 7 月。请参阅 http://www.annualreviews.org/page/journal/pubdates 了解修订后的估计。
Grain boundaries in polycrystalline materials migrate to reduce the total excess energy. It has recently been found that the factors governing migration rates of boundaries in bicrystals are insufficient to explain boundary migration in polycrystals. We first review our current understanding of the atomistic mechanisms of grain boundary migration based on simulations and high-resolution transmission electron microscopy observations. We then review our current understanding at the continuum scale based on simulations and observations using high-energy diffraction microscopy. We conclude that detailed comparisons of experimental observations with atomistic simulations of migration in polycrystals (rather than bicrystals) are required to better understand the mechanisms of grain boundary migration, that the driving force for grain boundary migration in polycrystals must include factors other than curvature, and that current simulations of grain growth are insufficient for reproducing experimental observations, possibly because of an inadequate representation of the driving force. Expected final online publication date for the Annual Review of Materials Research, Volume 53 is July 2023. Please see http://www.annualreviews.org/page/journal/pubdates for revised estimates.