Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation
Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation
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DOI：
10.1016/s1359-6454(96)00325-4
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发表时间：
1997-05
期刊：
影响因子：
9.4
通讯作者：
Byeong-Joo Lee;N. Hwang;Hyuck-Mo Lee
中科院分区：
文献类型：
--
作者：
Byeong-Joo Lee;N. Hwang;Hyuck-Mo Lee
提出了一种新的方案来预测在焊接过程中首先在基板/焊料界面形成的金属间化合物。假设在基板和液态焊料之间的界面处存在局部平衡。通过计算基板和液体焊料相之间的亚稳平衡，并通过比较计算的驱动力的形成为各个阶段，化合物，形成第一个在基板/焊料界面可以成功地预测。对Cu基体与Sn-Pb、Sn-Bi和Sn-Zn二元共晶钎料界面反应的预测与已有的实验结果一致。
A new scheme to predict the intermetallic compound which forms first at the substrate/solder interface during the soldering process has been suggested. A local equilibrium was assumed at the interface between the substrate and the liquid solder. By calculating metastable equilibria between the substrate and the liquid solder phases and by comparing the calculated driving forces of formation for individual phases, the compound which forms first at the substrate/solder interface could be successfully predicted. The prediction of interface reactions between Cu substrate and Sn-Pb, Sn-Bi and Sn-Zn binary eutectic solder was in agreement with already known experimental results.