Investigation of Heat Transfer within an Array of Impinging Jets with Local Extraction of Spent Fluid

Investigation of Heat Transfer within an Array of Impinging Jets with Local Extraction of Spent Fluid
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通过局部提取废液研究冲击射流阵列内的传热

DOI:
10.1615/ihtc15.mtr.008875
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发表时间:
2014
期刊:
影响因子:
17.1
通讯作者:
W. Schabel
W. Schabel
中科院分区:
材料科学1区
文献类型:
--
作者:
P. Cavadini;P. Scharfer;W. Schabel

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高科技功能薄膜制造过程中最敏感的步骤之一是干燥过程。有机和印刷电子产品(例如聚合物太阳能电池、OLEDS 或锂离子电池)的性能取决于干燥条件,因此必须在预定条件下实现均匀干燥。在过去的几十年中,已经证明可以使用冲击射流阵列来实现高干燥速率。缺点是交换变量领域的分布高度不均匀。为了最大限度地减少相邻射流相互作用造成的影响,必须在相互作用前提取废空气。由于目标板不能用于将用过的流体排出域,因此必须使用孔板中的孔来实现提取。在这项工作中,使用商用求解器 ANSYS FLUENT 进行了数值研究,以确定冲击射流阵列内目标板的局部传热系数的分布,并局部提取废液。所提出的案例研究包括喷嘴设计和阵列结构的变化。基于这些研究,将使用热致变色液晶(TLC,[1])进行瞬态传热实验,以研究最有前途的配置。
One of the most sensitive steps during the manufacturing of high technological functional films is the drying process. The performance of organic and printed electronics (e.g. polymer solar cells, OLEDS or Li-Ion batteries) depends on the drying conditions and hence homogeneous drying under predefined conditions has to be realized. Over the last decades it has been shown that arrays of impinging jets can be used to achieve high drying rates. The disadvantage is the highly inhomogeneous distribution in the field of the exchange variables. To minimize the effects caused by interaction of neighboring jets, the spent air has to be extracted pre interaction. Since the target plate can’t be used to route the spent fluid out of the domain, the extraction realized has to be using holes in the orifice plate. In this work, numerical investigations using the commercial solver ANSYS FLUENT have been performed to determine the distribution of the local heat transfer coefficient at the target plate within an array of impinging jets with local extraction of the spent fluid. The presented case studies include a variation in nozzle design and array structure. Based on these studies, transient heat transfer experiments using thermochromic liquid crystals (TLCs, [1]) will be performed to investigate the most promising configurations.