A flexible thermoelectric film based on Bi2Te3 for wearable applications

A flexible thermoelectric film based on Bi2Te3 for wearable applications
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DOI:
10.1142/s1793604722510055
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发表时间:
2022-01-01
影响因子:
1.3
通讯作者:
Pan, Xinxiang
Pan, Xinxiang
中科院分区:
材料科学4区
文献类型:
--
作者:
Liu, Changxin;Zhao, Kaiyuan;Pan, Xinxiang

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近年来,随着物联网(IoT)和可穿戴技术的发展,极大地促进了热电材料的研究和探索。然而,传统的热电材料是刚性和脆性的。由这些材料制成的热电器件通常不能紧密地附着在提供温差的热源和冷源上,从而限制了热电材料的应用。因此,制造新的高性能柔性热电器件仍然是一个巨大的挑战。采用电子沉积技术制备了聚酰亚胺/铜(PI/Cu)基底。通过将N型和P型碲化铋(Bi 2 Te 3)浆料键合到PI/Cu衬底上制备了柔性热电薄膜器件。然后,将PDMS膜涂覆在器件上以使器件防水和抗氧化。该器件在80 K温度下的输出电压和最大功率分别达到97.5mV和60 μ W。经过200次循环弯曲实验后,可保持90%的高电导率保持率。结果表明,该柔性热电薄膜具有良好的柔性和稳定性。该工作为柔性热电薄膜的制备提供了一种简单的方法,为其在物联网传感设备和可穿戴设备中的应用开辟了新的途径。
In recent years, with the development of the Internet of Things (IoT) and wearable technology, the research and exploration of thermoelectric materials have been greatly promoted. However, traditional thermoelectric materials are rigid and brittle. Thermoelectric devices made of these materials usually cannot be closely attached to the heat and cold sources that provide temperature differences, thus limiting the application of thermoelectric materials. Therefore, manufacturing new high-performance flexible thermoelectric devices is still a huge challenge. In this work, polyimide/copper (PI/Cu) substrate was deposited by electron deposition technology. The flexible thermoelectric thin film device was fabricated by bonding N-type and P-type bismuth telluride (Bi2Te3) slurries onto the PI/Cu substrate. Then, the PDMS film was coated on the device to make the device waterproof and oxidation resistant. The output voltage and maximum power of this device, at the temperature of 80 K, reach 97.5 mV and 60 uW, respectively. After 200 cycles of cyclic bending experiments, 90% high conductivity retention can be maintained. It demonstrates that the new flexible thermoelectric thin film has good flexibility and excellent stability. This work provides a simple method for the preparation of flexible thermoelectric thin films and opens up a new way for its application in the sensing equipment and wearable device of the IoT.