High ductility of a metal film adherent on a polymer substrate
High ductility of a metal film adherent on a polymer substrate
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DOI：
10.1063/1.2108110
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发表时间：
2005-10-17
影响因子：
4
通讯作者：
Vlassak, JJ
中科院分区：
文献类型：
--
作者：
Xiang, Y;Li, T;Vlassak, JJ
在可变形电子学的最新发展中，人们注意到金属薄膜经常在小的拉伸应变下破裂。本文报道了在聚合物基底上沉积Cu薄膜的实验，并表明金属薄膜的破裂应变对其与基底的粘附非常敏感。结合良好的Cu薄膜可以承受高达10%的应变而没有明显的裂纹，高达30%的应变而有不连续的微裂纹。相反，结合不良的Cu薄膜在应变约2%时形成沟道裂纹。裂纹是由应变局部化和晶间断裂混合形成的。在大应变下，当附着的衬底延迟局部化时，薄膜破裂。(C) 2005美国物理研究所。
In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture. The films rupture at large strains when the localization is retarded by the adherent substrates. (C) 2005 American Institute of Physics.