Application of nanofluids to a heat pipe liquid-block and the thermoelectric cooling of electronic equipment
Application of nanofluids to a heat pipe liquid-block and the thermoelectric cooling of electronic equipment
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DOI：
10.1016/j.expthermflusci.2011.04.015
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发表时间：
2011-10
影响因子：
3.2
通讯作者：
N. Putra;Yanuar;Ferdiansyah N. Iskandar
中科院分区：
文献类型：
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作者：
N. Putra;Yanuar;Ferdiansyah N. Iskandar
微处理器的功耗在不断增加。微处理器尺寸的增加也导致了更高的热流密度。过去几年，信息技术的发展迅速增长，导致对具有非常高计算能力的微处理器的需求增加。上一代中央处理器(CPU)中植入了11.7亿个晶体管，这表明产生了大量的热量。高端CPU产生的总散热约为110-140W，随着CPU电压和频率的增加，散热会增加。传统的风冷冷却系统不再足以消除这些热流。对于许多应用，直接空气冷却系统将不得不被其他高性能紧凑型冷却技术所取代或增强。本文研究了纳米流体作为工质在热管式热电制冷液块中的应用。讨论了作为PC热泵的纳米流体的体积浓度、冷却液温度和热电系统的类型及其对CPU温度的影响。并与其他传统冷却技术的结果进行了比较。热管液块与热电系统相结合，对CPU的换热有显著影响。采用纳米流体的热管、液块和热电制冷系统具有较高的热性能，证明了纳米流体作为工质的潜力。
Microprocessor power dissipation is constantly increasing. An increase in microprocessor size has also resulted in higher heat fluxes. The growth of information technology has rapidly increased over the past few years, causing an increase in the demand for a microprocessor that has a very high computing ability. The previous generation of central processing units (CPU) had 1.17 billion transistors planted in it, which indicates that a significant amount of heat was generated. The total heat dissipation resulting from a high end CPU is approximately 110–140W, which will increase if the CPU voltage and frequency increase. Conventional air-cooled cooling systems are no longer adequate to remove these heat fluxes. For a number of applications, direct air-cooling systems will have to be replaced or enhanced by other high performance compact cooling techniques. In this study, the application of nanofluids as the working fluid on a heat pipe liquid-block combined with thermoelectric cooling is investigated. The type and effect of volume concentrations of nanofluids, coolant temperature, and thermoelectricsystem as heat pumps of a PC on the CPU’s temperature are considered. The results obtained from this technique are compared to those from other conventional cooling techniques. The heat pipe liquid-block combined with the thermoelectric system has a significant effect on heat transfer from the CPU. The higher thermal performance heat pipe liquid-block and thermoelectric cooled system with nanofluids proved its potential as a working fluid.