Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer
Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer
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DOI：
10.1016/j.microrel.2022.114681
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发表时间：
2022-09
影响因子：
1.6
通讯作者：
H. Jiang;S. Robertson;S. Liang;Z. Zhou;L. Zhao;C. Liu
中科院分区：
文献类型：
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作者：
H. Jiang;S. Robertson;S. Liang;Z. Zhou;L. Zhao;C. Liu
