Small crack growth behavior and evaluation of growth rate of copper processed by equal channel angular pressing

Small crack growth behavior and evaluation of growth rate of copper processed by equal channel angular pressing
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等通道角压加工铜的小裂纹扩展行为及扩展速率评价

DOI:
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发表时间:
2012
期刊:
International Journal of Modern Physics, C-series
影响因子:
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通讯作者:
Sangshik Kim
Sangshik Kim
中科院分区:
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文献类型:
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作者:
Kusno Kamil;Masahiro Goto;Sueng- Zeon Han;Kwangjun. Euh;Norio Kawagoishi;Sangshik Kim

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