Formation of nanoporous platinum by selective dissolution of Cu from Cu0.75Pt0.25
Formation of nanoporous platinum by selective dissolution of Cu from Cu0.75Pt0.25
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DOI：
10.1557/jmr.2003.0030
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发表时间：
2003-01-01
影响因子：
2.7
通讯作者：
Corcoran, SG
中科院分区：
文献类型：
--
作者：
Pugh, DV;Dursun, A;Corcoran, SG
本文给出的结果表明，通过在1 M H2SO4中的Cu0.75Pt0.25合金的脱合金的纳米多孔铂的生产。场发射扫描电子显微镜和小角中子散射证实了直径约为3.4 nm的孔隙的存在。这是迄今为止从去合金化过程定量报告的最小孔隙率。小尺寸归因于Pt在室温下预期的极小的表面扩散率值，有效地消除了室温粗化过程。结果还表明，通过高温粗化可以获得更大的长度尺度。多孔铂的易于生产使其在可能的应用中具有吸引力，例如用于生物医学设备的高表面积电极或作为催化剂材料。
This paper gives results demonstrating the production of nanoporous platinum through the de-alloying of Cu0.75Pt0.25 alloy in 1 M H2SO4. Both field emission scanning electron microscopy and small angle neutron scattering confirm the presence of porosity with a diameter of approximately 3.4 nm. This is the smallest porosity quantitatively reported from a de-alloying process to date. The small size is attributed to the extremely small values of surface diffusivity expected for Pt at room temperature, effectively eliminating room-temperature coarsening processes. The results also show that larger length scales can be achieved through coarsening at elevated temperatures. The ease of production of porous platinum makes it attractive for possible applications, such as high surface area electrodes for biomedical devices or as catalyst materials.