Bond‐slip analysis via a thermodynamically consistent interface model combining interlocking, damage and friction
Bond‐slip analysis via a thermodynamically consistent interface model combining interlocking, damage and friction
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DOI：
10.1002/nme.2961
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发表时间：
2011-01
影响因子：
2.9
通讯作者：
R. Serpieri;G. Alfano
中科院分区：
文献类型：
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作者：
R. Serpieri;G. Alfano
阐述了一种结合了粘附、摩擦和联锁的基于热力学的内聚区界面公式。联锁是利用宏观描述来建模的，宏观描述以不同微平面的周期性排列的形式表示界面的几何形状，由代表性界面元素（RIE）表示。每个表面内的相互作用由 Alfano 和 Sacco 提出的组合损伤-摩擦界面公式控制 (textitInt. J. Numer. Meth. Engng 68(5):542–582)。尽管在每个单独的微平面上引入了与库仑摩擦相结合的简单损伤定律并且没有剪胀性，但由于 RIE 微观结构的存在引起的相互作用，可以预测键合滑移的整体剪胀性和滞后性质。该配方通过进行敏感性分析进行研究，并通过评估其在受控围压下的拉拔试验模拟中的性能进行验证。还报告了变幅重复加载下拉拔测试的结构模拟结果。版权所有 © 2010 约翰威利父子有限公司
A thermodynamics‐based cohesive‐zone interface formulation combining adhesion, friction and interlocking is illustrated. Interlocking is modeled exploiting a macroscopic description, which represents the geometry of the interface in the form of a periodic arrangement of distinct microplanes, denoted by Representative Interface Element (RIE). The interaction within each of these surfaces is governed by the combined damage–friction interface formulation proposed by Alfano and Sacco (textitInt. J. Numer. Meth. Engng 68(5):542–582). Although a simple damage law combined with Coulomb friction and no dilatancy is introduced on each individual microplane, the overall dilatant and hysteretic nature of the bond‐slip is predicted as a result of the interaction induced by the presence of the microstructure of the RIE. The formulation is investigated by performing sensitivity analyses and is validated by evaluating its performance in the simulation of pull‐out tests under controlled confining pressure. The results of a structural simulation of a pull‐out test under variable amplitude repeated loading are also reported. Copyright © 2010 John Wiley & Sons, Ltd.