Preferentially Oriented Cu[111] Layer Formed on Thin Nb Barrier on SiO2
Preferentially Oriented Cu[111] Layer Formed on Thin Nb Barrier on SiO2
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在 SiO2 上的薄 Nb 阻挡层上形成优先取向的 Cu[111] 层
DOI:
10.1143/jjap.45.9172
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发表时间:
2006
期刊:
影响因子:
--
通讯作者:
A. Noya
中科院分区:
文献类型:
--
作者:
M. Maniruzzaman;M. Takeyama;Masaru Sato;Y. Hayasaka;E. Aoyagi;A. Noya
The texture of preferentially oriented Cu[111] deposited on a thin Nb layer is characterized in a thin-film stacked structure of Cu/Nb/SiO2/Si in an attempt to prepare a Cu[111] seed layer of interconnects on an extremely thin diffusion barrier. The Cu[111] layer is obtained on Nb films of [110] orientation at various thicknesses; however, the mosaic spread of Cu[111] texture depends on the thickness of Nb film underneath. The full width at half maximum of the ω-rocking curve measurement is ∼3° for the Cu[111] layer on a 100-nm-thick Nb layer, which increases to ∼4 and ∼5° for that on 20- and 10-nm-thick Nb layers, respectively. Transmission electron microscopy reveals the 10-nm-thick Nb layer consisting of fine relatively mosaic-spread [110] grains, which is a result of the initial stage of the nucleation type growth of the Nb film in a columnar structure on SiO2. It is revealed that the Cu[111] texture of relatively good mosaicity in a columnar structure is obtained on an extremely thin Nb layer of 10 nm thickness.