Mechanism and thermal effect of delamination in light-emitting diode packages
Mechanism and thermal effect of delamination in light-emitting diode packages
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DOI：
10.1016/j.mejo.2006.08.001
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发表时间：
2007-02-01
影响因子：
2.2
通讯作者：
Shin, Moo Whan
中科院分区：
文献类型：
--
作者：
Hu, Jianzheng;Yang, Lianqiao;Shin, Moo Whan
这项工作报告了发光二极管 (LED) 封装中的分层机制及其对 LED 热特性的影响。 LED 样品经过湿气预处理，然后进行热块测试。进行瞬态热测量以研究分层 LED 的热行为。从瞬态测量中观察到热阻随着分层程度的增加而增加。通过耦合场有限元模拟计算出的热机械应力和湿机械应力分布与显微图像证据非常吻合。研究发现，对于 LED 封装中分层的发展，热机械应力比湿机械应力起着更重要的作用。研究发现，在 85°C/85RH 条件下进行 3 和 6 小时的湿度预处理对芯片和引线框架之间的分层影响不大。 (c) 2006 Elsevier Ltd. 保留所有权利。
This work reports on the mechanism of delamination in light-emitting diode (LED) packages and its effects on thermal characteristics of LEDs. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical and hygro-mechanical stress distributions calculated from coupled-field FEA simulation agree well with the micrographical evidence. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 and 6 h under 85 degrees C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame. (c) 2006 Elsevier Ltd. All rights reserved.