Process design kit for flexible hybrid electronics
Process design kit for flexible hybrid electronics
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适用于柔性混合电子产品的工艺设计套件
DOI：
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发表时间：
2018
期刊：
影响因子：
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通讯作者：
K. Cheng
中科院分区：
文献类型：
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作者：
Leilai Shao;Tsung;Ting Lei;Zhenan Bao;R. Beausoleil;K. Cheng
柔性电子 (FE) 正在兴起，适用于可穿戴设备和低成本物联网 (IoT) 节点，受益于其低成本制造和机械灵活性。将有限元与薄化硅芯片相结合，称为柔性混合电子器件 (FHE)，可以充分利用低成本印刷电子器件和高性能硅芯片的优势。为了设计 FHE 系统，需要提供 FE 和硅芯片的电路设计、仿真和验证功能的工艺设计套件 (PDK)。 FHE-PDK 的关键要素包括用于设计规则检查 (DRC)、布局与原理图 (LVS) 和布局寄生参数提取 (LPE) 的技术文件，以及用于柔性薄膜晶体管 (TFT) 和无源元件的 SPICE 兼容模型。晶圆尺寸测量用于验证我们的 SPICE 模型，并相应导出设计规则以确保令人满意的良率。因此，借助 FHE-PDK，电路和系统设计人员可以专注于设计创新，并可以依靠设计工具来生成可制造的设计。
Flexible Electronics (FE) is emerging for wearables and low-cost internet of things (IoT) nodes benefiting from its low-cost fabrication and mechanical flexibility. Combining FE with thinned silicon chips, known as flexible hybrid electronics (FHE), can take advantages of both low-cost printed electronics and high performance silicon chips. To design a FHE system, the process design kit (PDK) offering the capabilities for circuit design, simulation and verification for both FE and silicon chips is needed. The key elements of FHE-PDK include technology files for design rule checking (DRC), layout versus schematic (LVS) and layout parasitics extraction (LPE), as well as SPICE-compatible models for flexible thin-film transistors (TFTs) and passive elements. Wafer scale measurements are used to validate our SPICE models and design rules are derived accordingly to assure a satisfactory yield. With FHE-PDK, circuit and system designers can therefore focus on design innovations and can rely on design tools to produce manufacturable designs.