2F-5 Surface Preparation of 1-3 Piezocomposite Material for Microfabrication of High Frequency Transducer Arrays
2F-5 Surface Preparation of 1-3 Piezocomposite Material for Microfabrication of High Frequency Transducer Arrays
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2F-5 用于高频换能器阵列微加工的1-3压电复合材料的表面处理
DOI：
10.1109/ultsym.2007.37
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发表时间：
2007
期刊：
影响因子：
--
通讯作者：
Sandy Cochran
中科院分区：
文献类型：
--
作者：
A. Bernassau;S. Mckay;David Hutson;C. Démoré;Luis Garcia;Tim W. Button;J. McAneny;Sandy Cochran
超声成像阵列在30 MHz以上的频率下工作的关键问题是需要阵列电极的连续图案化。为了直接在1-3压电复合材料上实现这一点，需要平面、平行和光滑的表面。本文报道了1-3型压电复合材料的机械研磨和抛光表面的研究结果，表明可以获得良好的表面平整度。随后，高频阵列元件已被制造在这些表面上使用低温剥离光刻工艺。一个50 MHz的线性阵列与30妈妈元素间距已被图案化的研磨和抛光的低频1-3压电复合材料的表面上。获得了良好的电极边缘清晰度和与复合材料的电接触。此外，图案化已被证明在精细尺度的复合材料，本身适合于操作高于30 MHz。
A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 mum element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.