Void dynamics in lead‐free Sn‐Ag‐Cu solder joints
Void dynamics in lead‐free Sn‐Ag‐Cu solder joints
复制标题
无铅 SnâAgâCu 焊点中的空洞动态
DOI：
10.1002/pamm.201610296
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发表时间：
2016
期刊：
影响因子：
--
通讯作者：
Kerstin Weinberg
中科院分区：
文献类型：
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作者：
Marek Werner;Thomas Reppel;Kerstin Weinberg
由于Sn - Ag - Cu焊点的热载荷和机械载荷，气孔、缺陷和空洞可能会形核和生长。这种空穴成核是通过相场方法来研究的，这种方法解释了焊料分解成由其浓度描述的相。在本研究中，孔洞的生长仅由边界向内通量引起，不考虑晶粒尺寸和间隙的影响，参见[1]。自由能泛函由二阶泰勒展开近似，因此由体自由能密度和Ginzburg‐型梯度项组成。体自由能密度φ遵循经典的金兹堡-朗道双阱势。梯度能量系数κ依赖于φ，计算方法类似于[2]。实验数据已被用于模拟二维方形域上空洞浓度的时间演化。仿真基于B样条有限元分析。（©2016 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim）
As a result of thermal and mechanical loading of Sn‐Ag‐Cu solder joints pores, flaws and voids may nucleate and grow. Such void nucleation is studied here by means of a phase‐field approach which accounts for the decomposition of the solder into phases described by its concentrationc. In this investigation, the void growth results from boundary inward flux only, effects due to grain size and interstitials are not involved, cf. [1].The free energy functional is approximated by a second order Taylor expansion and thus composed of a bulk free energy density and a Ginzburg‐type gradient term. The bulk free energy density ϕ follows a classical Ginzburg‐Landau double‐well potential. The gradient‐energy coefficient κ depends on ϕ and is calculated similar to [2]. Experimental data have been adapted for the modeling of the temporal evolution of the concentration of voids located on a square domain in 2D. The simulation is based on a B‐spline finite element analysis. (© 2016 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)
影响因子：
3.1
作者：
Yulan Li;Shenyang Hu;Xin Sun;F. Gao;C. Henager;M. Khaleel
通讯作者：
Yulan Li;Shenyang Hu;Xin Sun;F. Gao;C. Henager;M. Khaleel
锌对(Ag-Sn)eut Zn液态合金表面张力、密度和摩尔体积的影响
DOI：
--
发表时间：
2016
期刊：
影响因子：
--
作者：
W. Gasior;J. Pstruś;Z. Moser
通讯作者：
Z. Moser