Indentation contact behavior of copper-graphite particulate composites : Correlation between the contact parameters and the electrical resistivity
Indentation contact behavior of copper-graphite particulate composites : Correlation between the contact parameters and the electrical resistivity
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DOI：
10.1016/j.carbon.2008.01.023
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发表时间：
2008-04
期刊：
影响因子：
10.9
通讯作者：
T. Futami;Masao Ohira;H. Muto;M. Sakai
中科院分区：
文献类型：
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作者：
T. Futami;Masao Ohira;H. Muto;M. Sakai
采用Vickers/球形压痕试验研究了铜-石墨颗粒复合材料的弹塑性接触表面变形。该复合材料包括各种含量的源自起始粉末的具有各种尺寸和形状的金属Cu颗粒，其与具有各种尺寸的天然石墨混合。用弹性模量E′、接触硬度H和硬度压痕的相对残余深度Δ r表征了复合材料的弹塑性表面变形。复合材料的表面变形与其微观结构和导电性有很好的相关性。结果表明，铜相渗流结构的演变是控制复合材料电阻率和塑性的关键。
The elastoplastic contact surface deformations of copper–graphite particulate composites are examined in instrumented Vickers/spherical indentation tests. The composites include various contents of metallic Cu-particles with various sizes and shapes originated from the starting powders, that are mixed with flaky natural graphite having various sizes. The elastoplastic surface deformations of the composites are characterized in term of the elastic modulus E′, contact hardness H, and the relative residual depth ξrof hardness impression. The surface deformations of the composites are well correlated to their microstructures and electrical resistivities. It is concluded that the evolution of the percolation structures of Cu-phases is essential in controlling the electrical resistivity and the plastic ductility of the composite.