Wafer-level chip scale packaging for piezoresistive pressure sensors using a dry-film shielding approach
Wafer-level chip scale packaging for piezoresistive pressure sensors using a dry-film shielding approach
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DOI：
10.1016/j.sna.2009.04.021
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发表时间：
2009-06-18
影响因子：
4.6
通讯作者：
Cheng, Wood-Hi
中科院分区：
文献类型：
--
作者：
Chen, Lung-Tai;Cheng, Wood-Hi
在这项研究中，展示了使用干膜屏蔽方法的压阻式压力传感器的晶圆级芯片规模封装（WL-CSP）。封装体内在压力传感器硅膜正上方预留有传感通道开口。为了保护压力传感器的硅膜免受金属沉积污染物的影响，在种子层溅射过程中，使用具有重新分布图案的干膜来屏蔽传感通道开口。实验结果表明，压力传感器的硅膜没有金属沉积污染，并且功能正常。该封装压力传感器满足未封装裸压力传感器的所有规格，在25-85摄氏度的工作温度范围内保持最大传感误差为1.24 kPa。所提出的压力传感器封装成本低且封装尺寸小，使其适合便携式消费产品。 (C) 2009 Elsevier B.V. 保留所有权利。
in this study, wafer-level chip scale packaging (WL-CSP) for piezoresistive pressure sensors using a dry-film shielding approach is demonstrated. A sensing-channel opening just above the silicon membrane of the pressure sensor is reserved in the package body. To protect the silicon membrane of the pressure sensors from metal-deposition contaminants, a dry-film with a redistribution pattern is used to shield the sensing-channel opening during the seed layer sputter process. Experimental results reveal that the silicon membrane of the pressure sensor is free of metal-deposition contamination and functionally operational. The packaged pressure sensor meets all of specifications of an unpackaged bare pressure sensor, holding a maximum sensing error of 1.24 kPa over an operation temperature range of 25-85 degrees C. The proposed pressure sensor packaging is low cost and has a tiny packaging size, making it suitable for portable consumer products. (C) 2009 Elsevier B.V. All rights reserved.