New prototype assembly methods for biosensor integrated circuits
New prototype assembly methods for biosensor integrated circuits
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DOI：
10.1016/j.medengphy.2011.03.006
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发表时间：
2011-10-01
影响因子：
2.2
通讯作者：
Taylor, John
中科院分区：
文献类型：
--
作者：
Graham, Anthony H. D.;Bowen, Chris R.;Taylor, John
Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (
