MICRO ULTRASONIC ABRASIVE MACHINING FOR THREE-DIMENSIONAL MILLI-STRUCTURES OF HARD-BRITTLE MATERIALS
MICRO ULTRASONIC ABRASIVE MACHINING FOR THREE-DIMENSIONAL MILLI-STRUCTURES OF HARD-BRITTLE MATERIALS
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硬脆材料三维纳米结构的微超声波磨料加工
DOI：
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发表时间：
2001
期刊：
影响因子：
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通讯作者：
K. Syoji
中科院分区：
文献类型：
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作者：
T. Kuriyagawa;T. Shirosawa;O. Saito;K. Syoji
近年来，由于光数字通信技术的进步，光电器件或微机电系统（MEMS）的每个组件的尺寸都已经减小。对陶瓷和玻璃等硬脆材料的微尺寸孔、狭缝和3D结构的需求是相当大的，这刺激了对用于微机械制造的新方法和系统的研究[1]-[4]。
The size of every component for opto-electrical devices or micro electro-mechanical systems (MEMS) has been reduced in recent years due to progress in opto-digital communications technology. The demands for micro-sized holes, slits and 3D structures of hard brittle materials such as ceramics and glass are considerable, and this has stimulated research into new methods and systems for a micro-mechanical fabrication [1]-[4].