Thermal fatigue reliability assessment for solder bump joint of BGA
Thermal fatigue reliability assessment for solder bump joint of BGA
复制标题
BGA焊点热疲劳可靠性评估
DOI：
10.1299/kikaia.67.216
复制
发表时间：
2001
期刊：
影响因子：
--
通讯作者：
Manabu Kifune
中科院分区：
文献类型：
--
作者：
Qiang Yu;Y. Kaga;M. Shiratori;Manabu Kifune
本文提出了利用总等效非弹性应变范围Δein和Manson-Coffin定律估算电子封装焊点热疲劳可靠性的方法。但在模型庞大的情况下，计算比较困难，需要建立一种简单的Δein计算方法。在这项研究中，作者提出了一个简单的方法有限元分析计算Δein。为了简化大量的非弹性分析，利用弹性分析的结果对焊点相对位移的近似公式进行了检验。另外，利用统计设计支持系统（SDSS），建立了焊点非弹性应变范围的计算公式。提出了热疲劳寿命的简易估算方法。
The authors have proposed the estimating method of thermal fatigue reliability for solder joints of electronic package, using the total equivalent inelastic strain range Δein and Manson-Coffin's law. However, as it is difficult to calculate it in the case of huge models, it is needed to establish a simple calculation method of Δein. In this study, the authors proposed a simple approach of FEM analysis for calculation of Δein. Approximate formula for relative displacements of solder joint using the results of the elastic analysis was examined in order to simplify huge inelastic analysis. In addition, using Statistical Design Support System (SDSS), they made the equation of inelastic strain range in the solder joints. And proposed simple estimation method of thermal fatigue life.