Electrodeposition for the synthesis of microsystems
Electrodeposition for the synthesis of microsystems
复制标题
用于微系统合成的电沉积
DOI：
10.1088/0960-1317/10/2/301
复制
发表时间：
2000
影响因子：
2.3
通讯作者：
J. Celis
中科院分区：
文献类型：
--
作者：
W. Ruythooren;K. Attenborough;S. Beerten;P. Merken;J. Fransaer;E. Beyne;C. Hoof;J. Boeck;J. Celis
电镀是一种用于生产微系统的新兴技术。这是由于其具有高沉积速率、高分辨率、高形状保真度、简单的可扩展性以及与微电子领域现有工艺的良好兼容性等优点。可以沉积的材料范围从焊接连接上的高导电性金属到铁磁体。本文回顾了电镀的基础知识，并介绍了电镀在微系统加工中的最新应用实例。
Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.