High-resolution 3D grain orientation mapping by inclined scanning 3D X-ray diffraction microscopy
High-resolution 3D grain orientation mapping by inclined scanning 3D X-ray diffraction microscopy
复制标题
通过倾斜扫描 3D X 射线衍射显微镜进行高分辨率 3D 晶粒取向映射
DOI:
10.1107/s160057672300715x
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发表时间:
2023
影响因子:
6.1
通讯作者:
M. Yabashi
中科院分区:
文献类型:
--
作者:
Jaemyung Kim;Yujiro Hayashi;M. Yabashi
The microstructure of a material plays a crucial role in determining its mechanical and chemical properties, as well as in predicting potential malfunctions. In polycrystalline materials, the orientation of each grain has a significant impact on the material's properties. It is thus imperative to conduct non-destructive 3D observations of the grain orientation with high resolution. This study presents a novel method to enhance the spatial resolution of 3D grain orientation maps in scanning 3D X-ray diffraction (S3DXRD) microscopy beyond the size of the probe beam. The new method, inclined scanning 3D X-ray diffraction (iS3DXRD) microscopy, combines an inclined geometry for the rotation axis of the object with the concept of `sub-voxel' analysis, where the voxel is subdivided into smaller pieces. The validity of the method was verified for a polycrystalline α-Fe wire using a 37 keV X-ray beam with a size of 10 × 20 µm (horizontal × vertical), and it successfully produced a high-resolution 3D grain orientation map with a spatial resolution of about 2.5 µm. The method can provide complex details on the microstructure of a polycrystalline material, which will pave the way for precise prediction of the material's properties.