High-resolution 3D grain orientation mapping by inclined scanning 3D X-ray diffraction microscopy

High-resolution 3D grain orientation mapping by inclined scanning 3D X-ray diffraction microscopy
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通过倾斜扫描 3D X 射线衍射显微镜进行高分辨率 3D 晶粒取向映射

DOI:
10.1107/s160057672300715x
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发表时间:
2023
影响因子:
6.1
通讯作者:
M. Yabashi
M. Yabashi
中科院分区:
材料科学3区
文献类型:
--
作者:
Jaemyung Kim;Yujiro Hayashi;M. Yabashi

文献摘要

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材料的微观结构在确定其机械和化学性能以及预测潜在故障方面起着至关重要的作用。在多晶材料中,每个晶粒的取向对材料的性能有显著影响。因此,必须进行非破坏性的高分辨率的晶粒取向的三维观察。本研究提出一种新的方法,以提高空间分辨率的三维晶粒取向图扫描三维X射线衍射(S3 DXRD)显微镜的探测光束的尺寸之外。新的方法,倾斜扫描三维X射线衍射(iS 3DXRD)显微镜,结合了倾斜的几何形状的旋转轴的对象与“子体素”分析的概念,其中体素被细分为更小的块。利用37 keV、10 × 20 µm(水平×垂直)的X射线束对多晶α-Fe丝进行了验证,成功地获得了空间分辨率约为2.5 µm的高分辨率三维晶粒取向图。     该方法可以提供多晶材料微观结构的复杂细节,这将为精确预测材料的性能铺平道路。
The microstructure of a material plays a crucial role in determining its mechanical and chemical properties, as well as in predicting potential malfunctions. In polycrystalline materials, the orientation of each grain has a significant impact on the material's properties. It is thus imperative to conduct non-destructive 3D observations of the grain orientation with high resolution. This study presents a novel method to enhance the spatial resolution of 3D grain orientation maps in scanning 3D X-ray diffraction (S3DXRD) microscopy beyond the size of the probe beam. The new method, inclined scanning 3D X-ray diffraction (iS3DXRD) microscopy, combines an inclined geometry for the rotation axis of the object with the concept of `sub-voxel' analysis, where the voxel is subdivided into smaller pieces. The validity of the method was verified for a polycrystalline α-Fe wire using a 37 keV X-ray beam with a size of 10 × 20 µm (horizontal × vertical), and it successfully produced a high-resolution 3D grain orientation map with a spatial resolution of about 2.5 µm. The method can provide complex details on the microstructure of a polycrystalline material, which will pave the way for precise prediction of the material's properties.