Modeling Hardware Trojans in 3D ICs
Modeling Hardware Trojans in 3D ICs
复制标题
3D IC 中的硬件木马建模
DOI：
10.1109/isvlsi.2019.00093
复制
发表时间：
2019
期刊：
影响因子：
--
通讯作者：
Qiaoyan Yu
中科院分区：
文献类型：
--
作者：
Zhiming Zhang;Qiaoyan Yu
三维(3D)集成便于将越来越多的晶体管集成到单个封装中。尽管性能和能效得到了提高，但将多个芯片集成到同一封装中可能会导致新的安全威胁，如3D硬件特洛伊木马。在这项工作中，我们首先对已报道的3D集成电路和系统中的硬件木马进行了全面的调查，然后提出了全面的3D硬件木马模型。通过一个案例验证了热触发3D木马的实现可行性。将3D木马的激活速度与2D木马的激活速度进行比较，以确认3D IC为隐藏热木马提供了更好的环境。
Three-dimensional (3D) integration facilitates to integrate increasing number of transistors into a single package. Despite of improved performance and power efficiency, the integration of multiple dies into the same package potentially leads to new security threats, such as 3D hardware Trojans. In this work, we first provide a thorough survey of reported hardware Trojans in 3D integrated circuits and systems, and then propose comprehensive 3D hardware Trojan models. A case study is performed to verify the implementation feasibility of thermal-triggered 3D Trojan. The activation speed of the 3D Trojan is compared to its 2D counterpart to confirm that 3D IC provides a better environment to hide thermal Trojans.