Single-mode glass waveguide platform for DWDM chip-to-chip interconnects
Single-mode glass waveguide platform for DWDM chip-to-chip interconnects
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用于 DWDM 芯片间互连的单模玻璃波导平台
DOI：
10.1109/ectc.2012.6249039
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发表时间：
2012
期刊：
影响因子：
--
通讯作者：
K. Lang
中科院分区：
文献类型：
--
作者：
L. Brusberg;H. Schroder;M. Queisser;K. Lang
光单模信号传输由于具有较高的带宽潜力，优于电和光多模信号传输。多年来，光单模光纤电缆一直用于电信网络。然而，在印刷电路板和模块中，缺乏基于光单模互连的光子系统集成，用于光电元件与光纤之间的信号传输。因此，提出了一种单模信号传输的基于薄玻璃的光子集成概念。光波导和光自由空间互连集成在一个或一叠薄玻璃片模块和印刷电路板封装。对于薄玻璃片内的光路由，开发了晶圆级（150 mm）单模波导技术，有望扩大面板尺寸（45 × 60 cm2）。该波导具有单模特性，在1550 nm波长处具有低传播（0.05 dB/cm）和光纤耦合（- 0.3 dB）损耗。不同的波导结构，如180°弯曲，s弯曲，分裂和交叉已经集成在薄玻璃和详细表征。本文还对耦合机理和误差损失进行了研究。介绍了光纤激光在玻璃上的连接技术和光学反射镜的激光结构，并给出了初步成果。通用模块和基于板的光子封装解决方案可以通过应用所有介绍的技术付诸实践，并将在芯片到光纤模块封装平台上进行演示。
Due to high bandwidth potential, optical single-mode signal transmission is superior to electrical as well as optical multimode signal transmission. For years, optical single-mode fiber cables have been used in telecommunication networks. However, there is a lack of photonic system integration based on optical single-mode interconnects in printed circuit boards and modules for signal transmission between electro-optical components and optical fibers. Therefore, a thin glass-based photonic integration concept for single-mode signal transmission was developed. Optical waveguides and optical free space interconnects are integrated in a single or a stack of thin glass sheets for module and printed circuit board packaging. For light routing inside a thin glass sheet, a singlemode waveguide technology on wafer level (150 mm) was developed promising for scaling up on panel size (45 × 60 cm2). The waveguides show single-mode behavior, low propagation (0.05 dB/cm) and fiber coupling (- 0.3 dB) losses at wavelength of 1550 nm. Different waveguide structures such as 180°-bends, S-bends, splitters and crosses have been integrated in thin glass and characterized in detail. Coupling mechanism and misalignment loss has also been studied. Technologies for fiber laser joining on glass as well as laser structuring of an optical mirror are introduced and first results are presented. Generic module and board-based photonic packaging solutions can be put into practice by applying all introduced technologies and will be demonstrated for a chip-to-fiber module package platform.